The doi above is for this specific version of this dataset, which is currently the latest. Newer versions may be published in the future. For a link that will always point to the latest version, please use
doi: 10.4121/13011239

Chittock, Nicholas (2020): Isotropic plasma atomic layer etching of Al2O3. Version 1. 4TU.ResearchData. dataset. https://doi.org/10.4121/13011239.v1

Dataset

• Atomic, Molecular, Nuclear, Particle and Plasma Physics

Etch Rate

CC0

RefWorks, BibTeX, Reference Manager, Endnote, DataCite, NLM, DC, CFF

by Nicholas Chittock

Data used to plot all of the figures in the letter titled "Isotropic plasma atomic layer etching of Al2O3 using a fluorine containing plasma and Al(CH3)3)". Each figure has its own page, original origin files are available upon request.

• 2020-10-21 first online, published, posted

4TU.ResearchData

Isotropic plasma atomic layer etching of Al2O3 using a fluorine containing plasma and Al(CH3)3)

• NWO Project 17124 "Atomic Layer Etching: Novel Plasma Processes for Anisotropic ánd Isotropic Etching"

Eindhoven University of Technology